Its low volume resistivity ensures seamless signal integrity and effective EMI shielding within complex assemblies. Designed for maximum durability, our conductive glue offers excellent thermal stability and chemical resistance, ensuring long-term reliability in demanding environments. Whether utilized in microelectronics, sensor technology, or automotive systems, EMI-tec delivers the material science required for the hardware of tomorrow.
Conductive Glue
EMI-tec compound material cure by normal air humidity and takes itself the necessary amount of moisture out of the environment. Crosslinking by the right formula supervised and controlled by the manufacturer results in high quality at the customer.
No complicate quality control is needed for heating times nor expensive heating equipment and capacity is necessary. As EMI-tec Micro-SIL MP compound is a room temperature curing material it does not requires any special curing equipment for save and durable curing. This saves investment and gives you a secure and reliable process.
Regardless of the size of your parts or storage temperature - the EMI-tec gasket will be save crosslinked.
| Test Method | Units | MC-A3X-DY1I1 | MC-L6X-EX1J1 | MP-L6K-EY1JA | NC-A3X-EZ1F1 | NC-L6X-EZ1F1 | ML-A3X-XN1C1 | |
| Elastomer | Silicone | Silicone | Silicone | Silicone-Free | Silicone-Free | Silicone | ||
| Conductive | Ag | Ag/Al | Ag/Al | Ag | Ag/Al | Ag | ||
| Corrosion Prevention | no | no | yes | no | no | no | ||
| Curing System | Air Humidity | Air Humidity | Air Humidity | Air Humidity | Air Humidity | n / a | ||
| Number of components | 1 | 1 | 1 | 1 | 1 | 1 | ||
| ELECTRICAL PROPERTIES | ||||||||
| Volume Resistivity | mΩcm | < 2 | < 8 | < 9 | < 2 | < 8 | < 4 | |
| Shielding Effectiveness 200 MHz to 10 GHz |
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| PHYSICAL PROPERTIES | ||||||||
| Hardness | ||||||||
| Density (cured) | ||||||||
| Compression Set | ||||||||
| Adhesion Strength | ||||||||
| Deformation Strength | ||||||||
| Temperature Range | °C | -40 to +200 | -40 to +160 | -40 to +125 | -30 to +85, 24h +100 |
-30 to +85, 24h +100 |
-40 to +160 | |
| CURING REQUIREMENTS | ||||||||
| Time before Handling | h | 1 | 1 | 1 | 1 | 1 | n / a | |
| Full Cure | h | 24 | 24 | 24 | 24 | 24 | n / a |
